@Article{UedaReGuBeAbBe:2001:HiDoNi,
author = "Ueda, Mario and Reuther, H. and Gunzel, R. and Beloto, Antonio
Fernando and Abramof, Eduardo and Berni, Luis Angelo",
affiliation = "Instituto Nacional de Pesquisas Espaciais, Laborat{\'o}rio
Associado de Plasmas, (INPE, LAP)",
title = "High dose nitrogen and carbon shallow implantation in Si by plasma
immersion ion implantation",
journal = "Nuclear Instruments and Methods in Physics Research Section B:
Beam Interactions with Materials and Atoms",
year = "2001",
volume = "175-177",
pages = "715--720",
month = "Apr",
keywords = "Plasma immersion ion implantation, Silicon nitride, Silicon
carbide.",
abstract = "We have performed plasma immersion ion implantation (PIII)
processing to dope Si (0 0 1) wafers with nitrogen and carbon at
high doses, relying on two different PIII systems: one at the
Institute for Ion Beam Physics at Dresden and the other at INPE.
In the first system based on an ECR plasma source, we carried out
nitrogen and carbon implantation in Si samples at 35 keV, with
delivered doses (DD) ranging from 0.6×1017 to 3.1×1018
cm\−2. On the other hand, nitrogen implantation in Si
samples at 12 keV with doses from 1.2×1017 to 2.4×1018
cm\−2 were conducted in the second system with a glow
discharge plasma source. Surface characterizations of these
samples based on Auger electron spectroscopy (AES), surface
profiler, Fourier transform infrared (FTIR) spectroscopy and a
high-resolution X-ray diffractometer indicated different implanted
profiles, maximum implanted depths, stresses and etching depths,
as well as characteristic surface colors, depending on the doped
species, energies and used delivered doses. Comparisons of these
results and their interrelationship are discussed in this paper.",
copyholder = "SID/SCD",
issn = "0168-583X and 0167-5087",
language = "en",
targetfile = "59.pdf",
urlaccessdate = "04 maio 2024"
}